Investigation of thermal modes of a low-frequency amplifier in a 3D printed version
Keywords:
additive technologies, low-frequency amplifier, 3D printer, printing of electronic components, printed circuit board, Solidworks, 3D-MIDAbstract
The article discusses the possibility of providing thermal conditions for elements and functional units used in bulk printed circuit boards created using additive technologies. Calculations showing the thermal characteristics of components integrated into 3D-MID products made of dielectric material as well as calculations for reducing temperature indicators are presented. The analysis of experimental data is carried out. The calculations are performed using CAD SolidWorks
References
Белова О.В., Калачев П.Ю. Разработка и исследование элементов интенсификации теплообмена, изготовленных с применением аддитивных технологий // Аддитивные технологии: настоящее и будущее. Материалы III Международной научной конференции. М.: ВНИИАМ, 2017. С. 1–12.
3D-принтер DragonFly – революционное решение для изготовления многослойных печатных плат // Электроника: Наука, Технология, Бизнес. 2018. № 8 (00179). С. 134–136.
Javaid Butt. Exploring the Interrelationship between Additive Manufacturing and Industry 4.0 Designs 2020. V. 4, 13. P. 11–14. doi:10.3390/designs4020013.
Patrick F. Flowers, Christopher Reyes, Shengrong Ye, Myung Jun Kim, Benjamin J. Wiley. 3D printing electronic components and circuits with conductive thermoplastic filament // Additive Manufacturing. 2017. Volume 18. December. P. 156–163.
Yue Dong, Chao Bao, Woo Soo Kim. Sustainable Additive Manufacturing of Printed Circuit Boards // Joule 2. April 18. 2018. P. 579–582.
